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SK Hynix and TSMC agree to expand AI memory partnership

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  • SK Group Chairman Chey Tae-won and TSMC 6.94% Chairman C.C. Wei agreed at Computex 2026 to expand joint work on HBM and advanced packaging.digitimes
  • SK Hynix plans to double its memory wafer capacity within five years, with Chey saying the AI-driven shortage will persist until at least 2030, according to Reuters.reuters
  • Nvidia 2.95% CEO Jensen Huang also met Chey at the event and urged SK Hynix to accelerate HBM chip production as demand strains supply, UPI reported.upi

SK Group Chairman Meets TSMC CEO at Computex to Deepen AI Chip Cooperation

SK Group Chairman Chey Tae-won met with TSMC Chairman and CEO C.C. Wei during Computex 2026 in Taipei this week, with the two agreeing to expand cooperation on high-bandwidth memory and advanced packaging for next-generation AI semiconductors, according to Digitimes.digitimes

The meeting, which took place on the sidelines of the annual tech exhibition running June 2–5, came as Chey announced that SK Hynix plans to double its memory wafer production capacity within the next five years to address a global shortage of AI-related chips. “We will supply whatever is necessary,” Chey told reporters at Computex on June 2. “There will still be some shortage until 2030.”tomshardware

Strengthening the AI Triangle

The discussions between Chey and Wei centered on integrating SK Hynix’s HBM technology with TSMC’s advanced packaging capabilities, a partnership aimed at solidifying SK Hynix’s position in customized AI memory while enhancing TSMC’s AI computing ecosystem. The cooperation reflects the deepening ties within what industry observers call the “AI semiconductor triangle” linking SK Hynix, Nvidia, and TSMC.mk

During his Taiwan visit, Chey also met with Nvidia CEO Jensen Huang, who visited SK Hynix’s booth at Computex alongside the SK Group chairman. UPI reported that Huang urged SK Hynix to accelerate HBM production as AI demand continues to strain memory supply.x

Capacity Expansion and Market Context

SK Hynix’s plan to double wafer capacity represents an expansion beyond its previously announced $15 billion investment in next-generation memory manufacturing disclosed in February. Bloomberg first reported the doubling plan, noting it as a major expansion intended to ease the global shortage of memory chips essential to AI systems.bloomberg

The urgency behind the partnership is underscored by SK Hynix’s market position — the company disclosed last year that its entire 2026 memory chip lineup, covering both DRAM and NAND products, had already been fully secured by customers. TSMC remains SK Hynix’s largest foundry partner, making the expanded cooperation central to both companies’ AI strategies as demand for high-performance computing infrastructure continues to outpace supply.tradingkey

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