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Samsung Electronics announced Wednesday that it has begun shipping the industry’s first 12-layer HBM4E memory samples to major global customers, advancing the company’s position in the race to supply high-bandwidth memory for artificial intelligence systems.
The HBM4E samples deliver a stable per-pin speed of 14 gigabits per second, scalable up to 16 Gbps — representing more than a 20% increase over Samsung’s HBM4, which began mass production in February. Each stack provides up to 3.6 terabytes per second of memory bandwidth and 48 gigabytes of capacity, a more than 30% improvement over the previous generation.sedaily
Samsung said the memory is designed to maximize computing performance for large language models and next-generation AI systems, where rapid data throughput is essential. The company plans to expand the HBM4E lineup to include 32GB (8-layer) and 64GB (16-layer) configurations based on customer requirements.samsung
The shipment comes ahead of Samsung’s original schedule. In February, when the company announced mass production of HBM4, it indicated HBM4E samples would be delivered in the second half of 2026. Reports in April indicated Samsung was accelerating development to produce samples by May, with Nvidia identified as a key customer.gsmarena
Samsung first publicly showcased HBM4E at Nvidia’s GTC 2026 conference in March, where it highlighted the chip’s 16 Gbps speed and its partnership with Nvidia on AI memory solutions.samsung
The early sample shipment reflects Samsung’s effort to regain ground against SK Hynix, which has led the HBM market in recent years. Samsung’s HBM4 rollout was delayed from its original 2025 target due to yield challenges. Mass production of HBM4E will follow “aligned with customer schedules,” according to Samsung’s press release, after optimization of the initial samples.reddit