MediaTek to use only Intel packaging for next-gen chips

MediaTek said its next-gen chip program will exclusively use Intel ↗10.64% EMIB-T packaging, with tape-out planned for Q4 2026.wccftech
The move marks a shift from days earlier, when MediaTek said it supported both Intel’s and TSMC’s ↗6.94% competing CoWoS technology.indiatimes
MediaTek is designing custom AI chips for Alphabet’s ↗1.48% Google, and the commitment bolsters Intel’s push to win outside foundry customers.reuters

MediaTek Commits Exclusively to Intel’s EMIB-T Packaging for Next-Gen Chips

MediaTek has announced that its next-generation chip program will exclusively use Intel’s EMIB-T advanced packaging technology, with tape-out targeted for the fourth quarter of 2026 and mass production expected by the fourth quarter of 2027. The disclosure, made during the Goldman Sachs Taiwan Day conference, marks a departure from earlier reports that suggested the Taiwanese chip designer would use both Intel and TSMC packaging technologies.reuters

A Strategic Win for Intel Foundry

The commitment is a notable win for Intel’s foundry ambitions as CEO Lip-Bu Tan seeks to attract external customers. EMIB-T, an evolution of Intel’s Embedded Multi-die Interconnect Bridge technology, uses targeted silicon bridges to link components within a chip package rather than relying on a full silicon interposer, as TSMC’s competing CoWoS technology does. The approach aims to simplify manufacturing and reduce costs.247wallst

MediaTek is collaborating with Alphabet’s Google to develop custom AI chips, and reports from the Taiwanese supply chain suggest Google’s next-generation TPU may also employ EMIB-T packaging. Analyst Ming-Chi Kuo has noted that EMIB-T’s broader adoption will depend on yield rates, with Intel targeting 98% yields to match existing packaging methods in cost efficiency.wccftech

Computex 2026 and Intel’s Broader Momentum

The announcement coincides with Computex 2026 in Taipei, where Tan delivered a keynote on Tuesday outlining Intel’s vision across client computing, data centers, and AI infrastructure. During the keynote, Intel highlighted partnerships with Foxconn, SambaNova, and others on rackscale AI systems, and discussed purpose-built silicon work with customers including Google and Ericsson.servethehome

MediaTek’s exclusive EMIB-T commitment contrasts with statements the company made days earlier, when it said it supports both TSMC’s CoWoS and Intel’s EMIB technologies, allowing customers to choose between the two. The shift to exclusivity for this particular program suggests Intel’s packaging capabilities have cleared internal validation hurdles at one of the world’s largest fabless chip companies.indiatimes